Method for the electroless deposition of palladium

Details Method for the electroless deposition of palladium Method for the electroless deposition of palladium

1980-07-03

1981-07-21

Smith, John D.

Coating processes

Immersion or partial immersion

Metal base

427304, 4274431, 106 115, 106 121, 106 124, 106 128, C23C 302

Patent

active

042799511

ABSTRACT:
A bath for the electroless deposition of palladium comprises an aqueous solution of divalent palladium, ammonia or amine, and a tertiary amine borane. The bath may contain thio-organic, iminonitrile or other stabilizers. A hard palladium alloy is plated, having the composition of 1-3% amorphous borone, 1-3% crystalline PdH.sub.0.706, the remainder amorphous palladium. A strong laminate is formed when the alloy is plated on electroless nickel.

REFERENCES:
patent: 2915406 (1959-12-01), Rhoda et al.
patent: 3274022 (1966-09-01), Rhoda
patent: 3403035 (1968-09-01), Schneble, Jr. et al.
patent: 3418143 (1968-12-01), Sergienko
patent: 3754939 (1973-08-01), Pearlstein et al.
patent: 3814696 (1974-06-01), Verdone et al.
patent: 4004051 (1977-01-01), Kadison

Affiliated with

Also associated with

Rating

Method for the electroless deposition of palladium does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the electroless deposition of palladium, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the electroless deposition of palladium will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2433124