Method for the electrical bonding of thin film tantalum capacito

Details Method for the electrical bonding of thin film tantalum capacito Method for the electrical bonding of thin film tantalum capacito

1978-09-18

1980-10-14

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29843, H05K 334, H05K 336

Patent

active

042273005

ABSTRACT:
A method for electrically bonding tantalum thin film capacitor networks to other networks is described. A first non-conducting support member has a thin film tantalum capacitor mounted thereon. A second non-conducting support member has another component such as a resistor mounted thereon. The two non-conducting support members are placed in a back-to-back position so that the thin film tantalum capacitor and the other component are remote from each other. These two non-conducting support members are then bound together and dipped into a molten solder bath to form a solder coating on the metal elements of the completed network.

REFERENCES:
patent: 2756485 (1956-07-01), Abramson et al.
patent: 3723838 (1973-03-01), Kumagai
patent: 3786323 (1974-01-01), Peters et al.
patent: 3859722 (1975-01-01), Kinsky et al.

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