Method for the direct patterning of diamond films

Details Method for the direct patterning of diamond films Method for the direct patterning of diamond films

1990-12-07

1993-04-20

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Visible imaging including step of firing or sintering

430350, 430330, 427228, 427249, 427402, 427558, G03C 1100, B05D 302

Patent

active

052042103

ABSTRACT:
A method of forming a patterned, poly-crystalline diamond film on a substrate is disclosed. First, a photoresist layer is applied to a substrate. A diamond powder layer is formed on the photoresist layer either through spray-coating, dip-coating, spin-coating using a diamond-powder suspension, and the like. The photoresist layer is exposed to electromagnetic radiation through a mask either before or after the diamond powder layer is applied. Then, the photoresist layer is developed, after which the substrate is heated causing the photoresist layer to carbonize. The substrate is exposed to a mixture of hydrogen-containing and carbon-containing gases which are decomposed in a processing apparatus. Hydrogen in this gas mixture etches away at the carbonized photoresist layer leaving behind the patterned diamond powder layer. Carbon in these carbon-containing gases combines with the diamond particles in the diamond powder layer to form diamond structures on the substrate.

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