Method for the controlled storage and release of gases using...

Details Method for the controlled storage and release of gases using... Method for the controlled storage and release of gases using...

2004-11-24

2009-06-30

Lawrence, Frank M (Department: 1797)

Gas separation: processes

Solid sorption

C095S900000, C429S010000, C423S248000, C502S526000

Reexamination Certificate

active

07553352

ABSTRACT:
The present invention relates to a method of absorbing and/or storing gases, in which the gas to be stored is brought into contact with an electrochemically prepared metal-organic framework under conditions suitable for absorption of the gas, with absorption of the gas into the metal-organic framework occurring, and, if appropriate, the conditions are subsequently changed so that release of the stored gas occurs.

REFERENCES:
patent: 5648508 (1997-07-01), Yaghi
patent: 6491740 (2002-12-01), Wang et al.
patent: 2005/0124819 (2005-06-01), Yaghi et al.
patent: 202 10 139 (2003-07-01), None
patent: 103 55 087 (2005-06-01), None
patent: 2 708 002 (1995-01-01), None
patent: 09 227571 (1997-09-01), None
patent: 02/070526 (2002-09-01), None
patent: 02/088148 (2002-11-01), None
patent: 03/064030 (2003-08-01), None
Eddaoudi, Mohamed et al., “Systematic Design of Pore Size and Functionality in Isoreticular MOFS and Their Application in Methane Storage”, Science, vol. 295, pp. 469-472, 2002.
Chen, Banglin et al., “Interwoven Metal-Organic Framework on a Periodic Minimal Surface with Extra-Large Pores”, Science, vol. 291, pp. 1021-1023, 2001.

Affiliated with

Also associated with

Rating

Method for the controlled storage and release of gases using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the controlled storage and release of gases using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the controlled storage and release of gases using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4145622