Coating processes – Coating by vapor – gas – or smoke
Reexamination Certificate
2007-06-26
2007-06-26
Meeks, Timothy (Department: 1762)
Coating processes
Coating by vapor, gas, or smoke
C427S250000
Reexamination Certificate
active
10745281
ABSTRACT:
A method is described for closing openings in a film, for example, in microelectronic process technology, whereby substantially no deposition material passes through the openings, which can be important if fragile micro devices are positioned under the openings. The closure of these openings can cause an underlying cavity to be hermetically sealed, in which an object can be located. In particular the method provides a way for hermetically sealing cavities under controlled atmosphere and pressure in the encapsulation and sealing processes of cavities comprising fragile content. The cavities may comprise for example Micro Electro Mechanical Systems (MEMS). The method may be used for encapsulating devices which may require a controlled atmosphere and pressure encapsulation such as micro accelerometers, micro gyroscopes, micro tubes, vibration micro sensors, micro mirrors, micro mechanical resonators or “resonant strain gauges”, micro mechanical filters, micro switches, micro electrical circuits, micro relays, Integrated Circuits with air gaps etc.
REFERENCES:
patent: 5011793 (1991-04-01), Obinata
patent: 5962923 (1999-10-01), Xu et al.
patent: 6045666 (2000-04-01), Satitpunwaycha et al.
patent: 6136095 (2000-10-01), Xu et al.
patent: 6139697 (2000-10-01), Chen et al.
patent: 6159762 (2000-12-01), Scheiter et al.
patent: 6217721 (2001-04-01), Xu et al.
patent: 6218277 (2001-04-01), Hamamoto
patent: 6238533 (2001-05-01), Satitpunwaycha et al.
patent: 6337499 (2002-01-01), Werner
patent: 6358616 (2002-03-01), Jennings
patent: 2002/0089027 (2002-07-01), Xu et al.
patent: 198 10 286 (1999-09-01), None
patent: 0 783 108 (1997-07-01), None
patent: 0783108 (1997-07-01), None
patent: 98/23935 (1998-06-01), None
Ito, et al., “Influence of Ti, TiN and TiSi2.4underlayers on Al-Si-Cu reflow sputtering”, 1994 VMIC Conference, pp. 336-342, (Jun. 7-8, 1994).
Lui, et al., “Sealing of micromachined cavities using chemical vapor deposition methods: characterization and optimization”, IEEE Journal of Microelectromechanical Systems, vol. 8, No. 2, pp. 135-145, (Jun. 1999).
Tilmans, et al., “The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices”, Journal of Microelectromechanical Systems, vol. 9, No. 2, pp. 206-217, (Jun. 2000).
Wolf, et al., “Silicon Processing for the VLSI Era, vol. 1: Process Technology”, 2nded., Lattice Press, Sunset Beach, CA, chapter 11.8, pp. 475-477, (2000).
European Search Report dated Mar. 23, 2003 for European Patent Application No. EP 02 44 7270.
Rusu Cristina
Witvrouw Ann
Interuniversitair Microelektronica Centrum (IMEC)
Meeks Timothy
Stouffer Kelly M.
LandOfFree
Method for the closure of openings in a film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for the closure of openings in a film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the closure of openings in a film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3850120