Method for the closing, by laser, of electronic circuit packages

Details Method for the closing, by laser, of electronic circuit packages Method for the closing, by laser, of electronic circuit packages

1992-08-17

1993-10-05

Albritton, C. L.

Electric heating

Metal heating

By arc

219 8513, B23K 2600

Patent

active

052507823

ABSTRACT:
A method for the closing, by laser, of packages of electronic circuits, notably hybrid circuit packages, said method minimizing mechanical stresses. The soldering is done along a soldering path on the lid of the package. The soldering path is divided into segments and two consecutive segments are never soldered one after the other. The method can be applied to the closing of large-sized hybrid packages.

REFERENCES:
patent: 4521668 (1985-06-01), Osial et al.
patent: 4760240 (1988-07-01), Iikawa et al.
patent: 4960973 (1990-10-01), Fouche et al.
"A New Laser Hermetic Sealing Technique for Aluminum Package," Takeaki Sakai, IEEE Transactions on Components, Hybrids, and Manufacturing, No. 3, Sep. 87, New York, USA, pp. 433-436.
"Laser-welding the Large Mic--A New Approach to Hermetic Sealing", Gordon Simpson, Microwave Journal, vol. 27, No. 11, Nov. 1984, pp. 169-179.

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