Method for the attachment of components to a circuit board using

Details Method for the attachment of components to a circuit board using Method for the attachment of components to a circuit board using

1989-03-01

1990-04-17

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29841, 1562722, 1562733, 1562755, 228175, H05K 330

Patent

active

049168053

ABSTRACT:
For the attachment of components using the SMT method a procedure is suggested in which the adhesive used is activated prior to fitting of the components to the circuit board by irradiation with light having a wavelength in the range of 200 to 600 nm to such an extent that the desired initial tackiness is maintained and there is no formation of skin on the surface of the adhesive. This makes it possible to cause the adhesive composition to fully cure in a shorter time and at lower temperature than has been possible so far without the wettability of the adhesive during the fitting of the components to the circuit board being impaired.

REFERENCES:
patent: 4208005 (1980-06-01), Nate et al.
patent: 4312692 (1982-01-01), Ikeda et al.
patent: 4314870 (1982-02-01), Ishida et al.
patent: 4358331 (1982-11-01), Schmidt
patent: 4398660 (1983-08-01), Pampelone et al.
patent: 4427478 (1984-01-01), Corant et al.
patent: 4605465 (1986-08-01), Morgan
patent: 4778556 (1988-10-01), Wavy et al.
Anonymous, "Use of Adhesives with Chemical Activators for Attaching Devices to Printed Circuit Boards", #28814, Apr. 1988.

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