Method for the assembly of an electronic package

Details Method for the assembly of an electronic package Method for the assembly of an electronic package

1993-09-27

1996-07-30

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

257666, 257677, 257766, H01L 2158, H01L 23532

Patent

active

055403786

ABSTRACT:
There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.

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