Method for the assemblage of a semiconductor device

Details Method for the assemblage of a semiconductor device Method for the assemblage of a semiconductor device

1989-08-09

1990-11-20

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29841, H05K 334

Patent

active

049707809

ABSTRACT:
The invention relates to an improvement in the so-called flip-chip method for electrically connecting bonding pads of a semiconductor device, e.g., IC chips, and electrodes of a circuit board. In place of the conventional bumps formed of a solder alloy on the bonding pads, the bonding pads in the invention are formed of a material having electric conductivity and rubbery elasticity so that the reliability of the electric connection can greatly be improved.

REFERENCES:
patent: 3818279 (1974-06-01), Seeger, Jr. et al.
patent: 4812420 (1989-03-01), Matsuda et al.

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