Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1999-04-01
2000-09-26
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156237, 156240, 156241, 156247, 156277, 156289, 427147, 427149, 428202, 428714, B44C 1175, B32B 3100, C09J10300, B41M 312
Patent
active
061237949
ABSTRACT:
Methods for applying images to various porous surfaces, including gesso, are disclosed, including providing a porous substrate including a coating comprising water to a surface thereon and providing a paper including a coating comprising a water-soluble adhesive on a surface thereon, applying an image comprising a water-soluble ink to the water-soluble adhesive coated surface of the paper, contacting the coated porous substrate with the image-containing coated paper surface; and applying pressure to the noncoated paper surface, whereby at least a portion of the image-containing surface is absorbed into the coated porous substrate.
REFERENCES:
patent: 4105483 (1978-08-01), Lin
patent: 4279954 (1981-07-01), Johnard
patent: 4820559 (1989-04-01), Steelman
patent: 4966815 (1990-10-01), Hare
patent: 5032449 (1991-07-01), af Strom
patent: 5132165 (1992-07-01), Blanco
patent: 5133819 (1992-07-01), Croner
patent: 5229201 (1993-07-01), Blanco
patent: 5350474 (1994-09-01), Yamane
patent: 5418041 (1995-05-01), Kent et al.
patent: 5573865 (1996-11-01), Steelman et al.
patent: 5916723 (1999-06-01), West
patent: 5922159 (1999-07-01), Cahill
Lorengo J. A.
Sells James
LandOfFree
Method for the application of an image to a porous substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for the application of an image to a porous substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the application of an image to a porous substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2096602