Method for testing system-in-package devices

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07545158

ABSTRACT:
A method for testing System-In-Package (SIP) devices each having a plurality of electrical contacts is described. The method and apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time.

REFERENCES:
patent: 6515470 (2003-02-01), Suzuki et al.
patent: 6522777 (2003-02-01), Paulsen et al.
patent: 7095242 (2006-08-01), Bjork

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