Method for testing print circuit boards

Details Method for testing print circuit boards Method for testing print circuit boards

2006-08-01

2006-08-01

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S832000, C029S854000, C073S865400

Reexamination Certificate

active

07082666

ABSTRACT:
A method for testing a printed circuit board includes manufacturing a dedicated testing board having protrusive metal points corresponding to the points to be tested on the printed circuit board. A pressure sensitive conductive rubber layer is inserted between the protrusive metal points and the test points. The method connects the protrusive metal points with the points to be tested on the printed circuit board by using the pressure from the press and the flexibility of the conductive rubber. The testing board having protrusive metal points is connected to the dedicated tester through flat cables so that each protrusive metal point is connected to a test node in the tester.

REFERENCES:
patent: 5633471 (1997-05-01), Fukushima
patent: 5698990 (1997-12-01), Aussant et al.
patent: 6255834 (2001-07-01), Smith
“A multilayer board-type magnetic field probe with high spatial resolution and RF current estimation method for ICs”; Masuda, N.; Tamaki, N.; Wabuka, H.; Watanabe, T.; Ishizaka, K.; International Symposium on May 17-21, 1999; p. 801.

Affiliated with

Also associated with

Rating

Method for testing print circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for testing print circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for testing print circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3612386