Method for testing plurality of system-in-package devices...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S754090

Reexamination Certificate

active

07489155

ABSTRACT:
A method for testing System-In-Package (SIP) devices such as micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

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patent: 5484062 (1996-01-01), Rich
patent: 6476629 (2002-11-01), Bjork
patent: 6774662 (2004-08-01), Co et al.
patent: 2007/0210811 (2007-09-01), Cojocneanu et al.

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