Method for testing integrated circuits on a carrier substrate

Details Method for testing integrated circuits on a carrier substrate Method for testing integrated circuits on a carrier substrate

1992-05-22

1994-03-01

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

H01L 2152, H01L 2158, H01L 2166

Patent

active

052907104

ABSTRACT:
A method and apparatus is provided for testing integrated circuits and permanently affixing the ICs which are successfully tested to a product level carrier substrate. A modular test oven is used which allows the chips to be electrically and thermally tested with the chips non-permanently affixed to a carrier substrate. If all of the chips on the carrier substrate test good, then the temperature within the oven is elevated, thereby reflowing the solder balls and permanently affixing the chips to the carrier substrate.

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