Method for testing integrated circuits

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324 731, 437 8, G01R 3128

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active

053152417

ABSTRACT:
A substrate is provided as a test fixture for burning-in and testing integrated circuit devices. The substrate contains a plurality of unpackaged integrated circuit dice arranged in a regular matrix of rows and columns. The substrate is partitioned into an array of rectangles which can be easily broken apart. One integrated circuit die is attached in each rectangle. The integrated circuits are bonded to conductive traces in their respective rectangular areas, and the conductive traces are connected to common locations at one side of the substrate. Voltages can be applied to all of the devices simultaneously by contacting the common locations at the edge of the substrate. This allows for burn-in of all integrated circuit devices on the substrate in parallel, after which they can be separated and used individually on printed circuit boards.

REFERENCES:
patent: 4038648 (1977-07-01), Chesley
patent: 4289449 (1981-08-01), Ports et al.
patent: 4467400 (1984-08-01), Stopper
patent: 4956602 (1990-09-01), Parrish
patent: 4961053 (1990-10-01), Krug
patent: 5008614 (1991-04-01), Shreeve et al.
patent: 5012187 (1991-04-01), Littlebury
patent: 5038101 (1991-08-01), Murphy
patent: 5121053 (1992-06-01), Shreeve et al.
patent: 5126657 (1992-06-01), Nelson

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