Method for testing for faulty plated-through bores circuit board

Details Method for testing for faulty plated-through bores circuit board Method for testing for faulty plated-through bores circuit board

1987-07-17

1988-08-23

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Optical or pre-photocell system

356241, G01N 2188

Patent

active

047663251

ABSTRACT:
A method for testing for faultily plated-through bores in printed circuit boards by means of a light transmitter on one side of the respective bore and a receiver at the other side which receives light which penetrates through voids of the plated-through bore. An annular opening is formed around the bore to be evaluated, being applied after the plating-through and the depth thereof being slightly less than the thickness of the printed circuit board. The annular opening is illuminated. The light penetrating through the bore then indicates voids at which a faulty plating-through was carried out.

REFERENCES:
patent: 3785738 (1974-01-01), Hoppke
patent: 3812348 (1974-05-01), Cippke

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