Method for testing electrical characteristics of bumps

Details Method for testing electrical characteristics of bumps Method for testing electrical characteristics of bumps

2005-12-06

2005-12-06

Pert, Evan (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

06972583

ABSTRACT:
The present invention discloses a test method for the electrical characteristics of the bumps on wafer. That is, the bumps on the scribe lines and the bumps on the neighbor chips are in the status of electrical connections, therefore the electrical characteristics of the bumps on the neighboring chips could be verified by utilizing a probe to touch the bumps on the scribe lines. Because the bumps on the neighboring chips are not really contacted with the probe, the intact profile of the bumps on the neighboring chips certainly keeps the same.

REFERENCES:
patent: 5554940 (1996-09-01), Hubacher
patent: 5633122 (1997-05-01), Tuttle
patent: 5917197 (1999-06-01), Alswede et al.
patent: 5929650 (1999-07-01), Pappert et al.
patent: 5956567 (1999-09-01), Tomita
patent: 6127729 (2000-10-01), Fukuda
patent: 6207477 (2001-03-01), Motooka et al.
patent: 6300577 (2001-10-01), Tsujii
patent: 6327158 (2001-12-01), Kelkar et al.
patent: 06085019 (1994-03-01), None
patent: 06151535 (1994-05-01), None

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