Method for testing and screening electronic and photonic package

Details Method for testing and screening electronic and photonic package Method for testing and screening electronic and photonic package

1997-04-09

1998-04-28

Dombroske, George M.

Measuring and testing

Simulated environment

374 57, G01N 1700

Patent

active

057447330

ABSTRACT:
The specification describes a test procedure for evaluating the susceptibility of electronic and photonic device packages to degradation effects caused by ambient hydrogen in the device package during the service life of the packaged device. The test procedure uses a hydrogen soak in which the subassembly parts are immersed in high concentrations of hydrogen gas at moderately elevated temperatures. The hydrogen gas is preferably diluted with an inert gas such as nitrogen or argon for safety in handling and processing. The test procedure can be used to screen components once their susceptibility to hydrogen attack has been established.

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