Method for testing and burning-in a semiconductor wafer

Details Method for testing and burning-in a semiconductor wafer Method for testing and burning-in a semiconductor wafer

1995-11-03

1997-01-28

Chaudhari, Chandra

Fishing, trapping, and vermin destroying

437183, 437226, H01L 2166

Patent

active

055977375

ABSTRACT:
Flip-chip is fast becoming the mounting method of choice in the semiconductor industry for dice having a high number of contacts. Since many applications require known-good-die, these flip-chip semiconductor dice must be tested and burned-in. By testing and burning-in the semiconductor wafers prior to solder bumping, the probe tips (42, 44, 46 & 48) can contact the hard planar surface of the under-bump-metallurgy (40) on each bonding pad (14) for easier and more reliable contact and hence test results. The probe tips can be either of an array (42 & 44) or cantilevered needle (46 & 48) type. Blunt probe tips (42 & 48) are well-suited to making contact on the shoulder of each bonding pad of each semiconductor die, while sharp probe tips (44 & 46) are preferable for contacting the center of each bonding pad. Solder bumping is performed post-testing.

REFERENCES:
patent: 4950623 (1990-08-01), Dishon
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5470787 (1995-11-01), Greer
patent: 5495667 (1996-03-01), Farnworth et al.

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