Method for testing an integrated circuit device

Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed

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438 14, 438 15, G01R 3126, H01L 2166

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active

059305886

ABSTRACT:
A method for testing an integrated circuit situated on the top of a semiconductor substrate. The method includes the steps of focusing a photon onto a portion of the integrated circuit through an anti-reflective coating disposed on the back side of the semiconductor substrate and detecting the photon after the photon is reflected from the integrated circuit.

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Jacques I. Pankove, Optical Processes In Semiconductors, Dover Publications, Inc., New York, 1971, Properties Of Semiconductors Tables.
H.K. Heinrich, et al., "Optical Detection of Multibit Logic Signals at Internal Nodes in a Flip-Chip mounted Silicon Static Random-Access Memory Integrated Circuit", Journal Vacuum, Science and Technology, vol. 10, No. 6, pp. 3109-3111, Nov.-Dec.1992.
Melle Griot Catalogue Introductory Chapter, "Optical Coatings", Chapter 5, pp. 5:1-5:40, 1995.
H.K. Heinrich, et al., "Noninvasive Sheet Charge Density Probe for Integrated Silicon Devices", Appl. Phys. Lett. 48 (16), American Institute of Physics, pp. 1066-1068, Apr. 21, 1986.
Marvin Chester, et al., "Electroabsorption Spectrum in Silicon", University of California, LA, Physical Review Letters, vol. 13, No. 6, pp. 193-195, Aug. 10, 1964.

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