Method for testing a tape carrier package

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor

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438 18, 324365, G01R 3126

Patent

active

061271969

ABSTRACT:
Methods for testing a [A] tape carrier package (TCP) for an integrated circuit device that includes two sets of test pads. A first set of test pads are located along the outer edges of the TCP and are used to test the performance of the integrated circuit device once the TCP has been fabricated and assembled. A second set of test pads is also provided between the TCP outer leads and integrated circuit device for testing the performance of the device once the TCP has been removed from a printed circuit board.

REFERENCES:
patent: 4575747 (1986-03-01), Fritz
patent: 4772936 (1988-09-01), Reding et al.
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4806409 (1989-02-01), Walter et al.
patent: 4903113 (1990-02-01), Frankeny et al.
patent: 4949158 (1990-08-01), Ueda
patent: 4980219 (1990-12-01), Hiraide et al.
patent: 5008614 (1991-04-01), Shreeve et al.
patent: 5086335 (1992-02-01), Leibovitz et al.
patent: 5121053 (1992-06-01), Shreeve et al.
patent: 5189363 (1993-02-01), Bregman et al.
patent: 5221858 (1993-06-01), Higgins, III
patent: 5355105 (1994-10-01), Angelucci, Sr.
patent: 5572140 (1996-11-01), Lim et al.
patent: 5677203 (1997-10-01), Rates

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