Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent
1998-04-29
2000-10-03
Niebling, John F.
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
438 18, 324365, G01R 3126
Patent
active
061271969
ABSTRACT:
Methods for testing a [A] tape carrier package (TCP) for an integrated circuit device that includes two sets of test pads. A first set of test pads are located along the outer edges of the TCP and are used to test the performance of the integrated circuit device once the TCP has been fabricated and assembled. A second set of test pads is also provided between the TCP outer leads and integrated circuit device for testing the performance of the device once the TCP has been removed from a printed circuit board.
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Butera Richard R.
Huffman William A.
Intel Corporation
Murphy John
Niebling John F.
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