Method for testing a bumped semiconductor die

Details Method for testing a bumped semiconductor die Method for testing a bumped semiconductor die

1997-08-25

1999-11-16

Dutton, Brian

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Electrical characteristic sensed

438 17, 324765, H01L 2166, G01R 2126

Patent

active

059856823

ABSTRACT:
A method for testing a bumped semiconductor die (14) is accomplished without excessively deforming the conductive bumps (200). In one form, testing is accomplished using a test contactor (12) which includes a deformable layer (204), such as an elastomer, which is patterned to include a plurality of openings (202) corresponding in pattern to the conductive bumps (200). The die is positioned next to the test contactor and the two are compressed together. The walls of the openings in the elastomeric material constrain the deformation of the conductive bumps in the X-Y plane due to the lateral pressure exerted on the sides of the conductive bumps. In a second form, a mechanical standoff (216) limits the extent to which the die and the test contactor can approach, thereby limiting the deformation in the Z-axis. In a third form, both elastomeric material and mechanical standoff act to constrain the deformation in the X-, Y-, and Z- axes.

REFERENCES:
patent: 5477160 (1995-12-01), Love
patent: 5500605 (1996-03-01), Chang
patent: 5880590 (1999-03-01), Desai et al.

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