Method for testing a ball grid array semiconductor device and a

Details Method for testing a ball grid array semiconductor device and a Method for testing a ball grid array semiconductor device and a

1996-01-26

1998-03-24

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, 324765, G01R 3102

Patent

active

057317097

ABSTRACT:
A ball grid array semiconductor device (30) includes a plurality of conductive balls (36) and a plurality of conductive castellations (18) around its periphery as redundant electrical connections to a semiconductor die (12). During testing of the device in a test socket (50), the conductive castellations are contacted by test contacts (54). The test contacts do not come in physical contact with the conductive balls. As a result, when testing is performed at elevated temperatures near the melting point of the conductive balls, the conductive balls are not deformed by the test contacts, thereby eliminating cosmetic-defects. Additionally, the absence of physical contact between the conductive balls and the test contacts during testing reduces the likelihood that conductive balls will inadvertently fuse to the test socket or create solder build-up on the test contacts.

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