Method for temporarily sealing holes in printed circuit boards u

Metal working – Method of mechanical manufacture – Electrical device making

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156155, 156247, 174 665, 427 97, H05K 302

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048843377

ABSTRACT:
A method for temporarily sealing holes in a printed circuit board laminate during processing is disclosed. A sheet of deformable material is placed on one side of the PCB and then deformed so that the material extends into each hole to form a protectively sealing plug therein. Thereafter, the other side of the PCB is coated with a suitable resist for subsequent processing. The resist can be either photo-imagable or non-photo-imagable, such as silk screening inks, lacquers and varnishes. After conventional processing of the resist coated PCB, the deformed sheet material that forms the protectively sealing plugs is removed from the PCB. In the preferred embodiment, deformation of the sheet material is accomplished by thermally deforming a thermodeformable sheet material with a pressure differential applied across the thickness of the sheet material. The thermodeformable sheet material preferably comprises either a low or high density polyethylene of polypropylene that can be re-used many times in order to reduce the material costs of practicing the method of the invention.

REFERENCES:
patent: 4445952 (1984-05-01), Reynolds, III et al.
patent: 4522667 (1985-06-01), Hanson et al.
IBM Tech. Discl Bull., vol. 11, No. 7, Dec. 1968 p. 733 by McDermott.
IBM Tech Discl Bull., vol, 12, No. 4, Sep. 1969 p. 512 by Mendola.
IBM Tech Discl Bull., vol. 14, No. 8, Jan. 1972 p. 2459 by Gardner, et al.

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