Method for temporarily sealing holes in printed circuit boards

Details Method for temporarily sealing holes in printed circuit boards Method for temporarily sealing holes in printed circuit boards

1986-11-26

1988-06-07

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

156155, 156247, 427 97, H05K 310

Patent

active

047487429

ABSTRACT:
A method for temporarily sealing holes in a printed circuit board laminate during processing is disclosed. A sheet of deformable material is placed on one side of the PCB and then deformed so that the material extends into each hole to form a protectively sealing plug therein. Thereafter, the other side of the PCB is coated with a suitable resist for subsequent processing. The resist can be either photo-imagable or non-photo-imagable, such as silk screening inks, lacquers and varnishes. After conventional processing of the resist coated PCB, the deformed sheet material that forms the protectively sealing plugs is removed from the PCB. In the preferred embodiment, deformation of the sheet material is accomplished by thermally deforming a thermodeformable sheet material with a pressure differential applied across the thickness of the sheet material. The thermodeformable sheet material preferably comprises either a low or high density polyethylene or polypropylene that can be re-used many times in order to reduce the material costs of practicing the method of the invention.

REFERENCES:
patent: 4445952 (1984-05-01), Reynolds, III et al.
patent: 4522667 (1985-06-01), Hanson et al.
IBM Tech Discl Bull, vol. 11, No. 7, Dec. 1968, p. 773, by McDermott.
IBM Tech Discl Bull, vol. 12, No. 4, Sep. 1969, p. 512, by Mendola.
IBM Tech Discl Bull, vol. 14, No. 8, Jan. 1972, p. 2459, by Gardner, et al.

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