Method for tape automated bonding

Details Method for tape automated bonding Method for tape automated bonding

1990-06-27

1992-01-14

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

2281802, 228212, B23K 100

Patent

active

050802798

ABSTRACT:
Solder tape automated bonding of leads to an integrated circuit chip is performed using a constant temperature, flat faced thermode and a clamping plate to keep the leads in contact with the integrated circuit chip.

REFERENCES:
patent: 3765590 (1973-10-01), Duffek et al.
patent: 4657170 (1987-04-01), Muller
patent: 4979663 (1990-12-01), Sofia et al.

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