Method for surface treatment of polymeric substrates

Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge

Reexamination Certificate

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C204S165000

Reexamination Certificate

active

07147758

ABSTRACT:
Methods for treating polymeric substrates by placing the substrate in a gaseous mixture and subjecting it to a dielectric barrier electrical discharge. The gaseous mixture, which has a pressure around atmospheric, contains a carrier gas, a reducing gas and an oxidizing gas. The amount of the oxidizing gas in the gas mixture is between about 50 ppm and about 2000 ppm by volume, while the amount of the reducing gas in the gas mixture is between about 50 ppm and 30000 ppm by volume.

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Inagaki N: “Plasma surface modification and plasma polymerization”, Laboratory of Polymer Chemistry at Shizuoka University, TECHNOMIC Publishing Co., Inc., 1996.
Patent Abstracts of Japan, publication No. 05059197, publication date Mar. 9, 1993, application date Aug. 30, 1991, application No. 03220327.

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