Method for surface treatment of polyimide resin molded articles

Details Method for surface treatment of polyimide resin molded articles Method for surface treatment of polyimide resin molded articles

1994-01-18

1996-06-18

Dean, Ralph H.

Stock material or miscellaneous articles

Composite

Of polyimide

4272071, 427301, 427316, 427322, 427370, 427387, 156320, 156322, 1563315, B05D 510

Patent

active

055276210

ABSTRACT:
The surface of a polyimide molded article such as polyimide film is treated with a solution containing a basic compound, further treated with a solution containing a silane coupling agent and then subjected to a heat treatment. This greatly improves the adhesiveness of the polyimide molded article surface to the polyimide adhesive layer formed thereon. This invention can be applied to the production of substrates for flexible wiring boards having a polyimide film/polyimide adhesive/copper foil structure.

REFERENCES:
patent: 3822175 (1974-07-01), Yuen
patent: 4628003 (1986-12-01), Katz
patent: 4778727 (1988-10-01), Tesoro et al.
patent: 4797307 (1989-01-01), Kunimoto et al.
patent: 4842948 (1989-06-01), Galgliani
Polymer Science Technology, vol. 29, pp. 517-523, 1984.

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