Method for supporting printed circuit board assemblies

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29740, 29741, 269903, H05K 330

Patent

active

059640316

ABSTRACT:
A PCB support for supporting PCBs during surface mounting processing and other PCB assembly processes. In one embodiment, a PCB stand has a support structure attachable to an elevator table of a PCB processing machine and a platform connected to the support structure. The support structure may be a superstructure that can project away from the elevator table, and the platform may be a beam or other member that can support a significant portion of the surface area on the backside of the PCB. The superstructure and platform operate together to position the height of the platform with respect to the elevator table at an elevation at which the platform supports and interior region of the PCB assembly when the elevator table is in a processing position.

REFERENCES:
patent: 4850104 (1989-07-01), Matrone et al.
patent: 5208975 (1993-05-01), Hidese
patent: 5329692 (1994-07-01), Kashiwagi
patent: 5682675 (1997-11-01), Hirota
patent: 5711065 (1998-01-01), Asai et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for supporting printed circuit board assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for supporting printed circuit board assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for supporting printed circuit board assemblies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-644149

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.