Method for supplying wafers to an IC manufacturing process

Details Method for supplying wafers to an IC manufacturing process Method for supplying wafers to an IC manufacturing process

1999-06-29

2000-07-11

Keenan, James W.

Material or article handling

Process

Of emptying portable receptacle

414805, 414940, B65G 4907

Patent

active

060863234

ABSTRACT:
A method for unloading silicon wafers contained in a cassette from a sealed pod and supplying the wafers to an IC manufacturing process. The method includes receiving a base of the pod onto a loading platform of a pod loader interface and then unlocking the pod cover from the base. While maintaining the wafers in a clean mini-environment, the method raises the pod cover away from the base, contacts the now exposed cassette with an end effector of an articulated arm, secures the cassette to the end effector, and activates the arm to transport the wafers out of mini-environment for supplying the wafers to an IC manufacturing process. Preferably, the method further includes raising the articulated arm to lift the cassette before transferring the wafers to the process. Even more preferred, the method directs a flow of clean air within the mini-environment horizontally past the wafers.

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patent: 5885045 (1999-03-01), Rush
patent: 5895191 (1999-04-01), Bonora et al.
patent: 5934991 (1999-08-01), Rush

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