Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate
2008-04-01
2008-04-01
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
Applying or distributing fused filler
C228S257000
Reexamination Certificate
active
10530548
ABSTRACT:
Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.
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English Language Abstract of JP 8-64943.
English Language Abstract of KR 10-0270837.
English Language Abstract of JP 3-226365.
English Language Abstract of JP 2-012830.
English Language Abstract of JP 7-114205.
Andou Haruhiko
Furuno Masahiko
Ohashi Yuji
Onozaki Junichi
Saito Hiroshi
Greenblum & Bernstein P.L.C.
Japan Science and Technology Agency
Stoner Kiley
Tamura Corporation
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