Metal fusion bonding – Process – Using bond inhibiting separating material
Patent
1984-02-10
1985-10-29
Ramsey, Kenneth J.
Metal fusion bonding
Process
Using bond inhibiting separating material
228157, 228161, 228193, 428595, B23K 2018, B21D 2602
Patent
active
045496854
ABSTRACT:
A method of forming Y shaped support structures by diffusion bonding and/or superplastic forming wherein layers of metal capable of diffusion bonding and/or superplastic forming are placed in a sandwich-like assembly having a top, bottom and intermediate layers, the layers having been selectively coated with stop-off. The sandwich assembly is subjected to sufficient pressure and heat to diffusion bond and superplastically form the sandwich assembly into a Y shaped stringer or support structure. The layers and/or a reinforcing member are selectively coated with stop-off so as to form at least two Y shaped support structures.
REFERENCES:
patent: 3111747 (1963-11-01), Johnson
patent: 3834000 (1974-09-01), Miller
patent: 3920175 (1975-11-01), Hamilton et al.
patent: 3927817 (1975-12-01), Hamilton et al.
patent: 3934441 (1976-01-01), Hamilton et al.
patent: 4117970 (1978-10-01), Hamilton et al.
patent: 4294419 (1981-10-01), Fouse
patent: 4304821 (1981-12-01), Hayase
patent: 4351470 (1982-09-01), Swadling
patent: 4361262 (1982-11-01), Israeli
Superplastic Forming/Diffusion Bonding, Aug. 1978, NA-77-902, Rockwell Int'l.
Uberbacher, Superplastic Tools and Materials, IBM Technical Disc., vol. 11, No. 11, Apr. 1969, p. 1414.
Grumman Aerospace Corporation
Ramsey Kenneth J.
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