Method for structuring silicon carbide

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148DIG148, 156633, 156657, H01L 2142, H01L 21467

Patent

active

047359200

ABSTRACT:
A method for structuring silicon carbide by photolithography and plasma etching wherein a substrate of silicon carbide is covered on a flat side with a structured silicon layer, and the plasma etching is then carried out with a gaseous mixture of a halogenated hydrocarbon and oxygen, the oxygen being present in an amount of at least 40% and preferably 70 to 95% by volume.

REFERENCES:
patent: 3398033 (1968-08-01), Haga et al.
patent: 3510369 (1970-05-01), Ernick et al.
patent: 4595453 (1986-06-01), Yamazaki et al.
Kushner, J. Appl. Phys. 53 (4), Apr. 1982, pp. 2923-2938.
Munch et al, "Silicon Carbide Blue-Emitting Diodes Produced by Liquid-Phase Epitaxy", Solid State Electronics, vol. 121, (1978), pp. 1129-1132.
Chang et al, "Novel Passivation Dielectrics-The Boron or Phosphorous Doped Hydrogenated Amorphous Silicon Carbide Films", J. Electrochemical Society, Feb. 1985, pp. 418-422.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for structuring silicon carbide does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for structuring silicon carbide, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for structuring silicon carbide will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2233677

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.