Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2002-03-13
2008-08-26
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C257SE21214
Reexamination Certificate
active
07416961
ABSTRACT:
Disclosed is a method for structuring a flat substrate consisting of a glass-type material. The invented method is distinguished by a combination of the following steps:providing a semiconductor flat substrate consisting of a semiconductor material, structuring at least one surface of said semiconductor flat substrate to obtain recesses in said surface,connecting said surface of said semiconductor flat substrate to said glass-type flat substrate, with said structured surface of said semiconductor flat substrate being connected to a surface of said glass-type flat surface at least partially covering the same,tempering said connected flat substrates in such a manner that at least a part of the said glass-type material flows into said recesses of said structured surface of said semiconductor flat substrate,removing material at least from the resolidified glass-type flat substrate in such a manner that said glass-type flat substrate assumes a surface which is flush with said structured surface of said semiconductor flat substrate.
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Merz Peter
Quenzer Hans-Joachim
Schulz Arne Veit
Wagner Bernd
Antonelli, Terry Stout & Kraus, LLP.
Fraunhofer-Gesellschaft zur Förderung der Angewandten Forsc
Geyer Scott B.
Patel Reema
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