Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating a crossover
Reexamination Certificate
1998-12-01
2001-04-17
Dang, Thi (Department: 1763)
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating a crossover
C430S313000, C430S314000
Reexamination Certificate
active
06217783
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to multilayer circuit boards, and more particularly to multilayer circuit boards having air bridge circuits.
2. Disclosure Information
In the printed circuit board (PCB) industry, various methods are used to produce multilayer (i.e., two-or-more-layer) PCBs. U.S. Pat. No. 4,404,059 to Livshits et al. (hereinafter “Livshits”) and Pat. Ser. No. 5,738,797 to Belke et al. (hereinafter “Belke”), both of which are incorporated herein by reference, describe “additive” processes for PCB construction, while U.S. Pat. No. 3,801,388 to Akiyama et al. (hereinafter “Akiyama”), also incorporated herein by reference, teaches a “subtractive” process for PCB manufacture. These additive and subtractive processes involve various masking, plating, mask-stripping, chemical etching, and other steps for constructing multilayer circuit boards having features known as “air bridges”, “crossovers”, “air bridge crossovers”, and the like.
Air bridge crossover circuits are useful for creating high density circuits. However, such circuits sometimes suffer from susceptibility to mechanical damage, caused by physical impact, thermal excursions, and the like. It would be desirable, therefore, to provide a way of creating such multilayer air bridge circuits without this drawback.
SUMMARY OF THE INVENTION
The present invention overcomes the disadvantages of the prior art approaches by providing a multilayer air bridge circuit structure, and method for producing the same, which has special metallic fortifying layers which mitigate the aforementioned disadvantages.
It is an object and advantage that the present invention includes an air bridge circuit having metallic fortifying layers which mechanically and/or electrically enhance the circuit.
Another advantage is that the present invention may be easily and economically incorporated into both the additive and subtractive air bridge circuit construction processes.
These and other advantages, features and objects of the invention will become apparent from the drawings, detailed description and claims which follow.
REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 4289846 (1981-09-01), Parks et al.
patent: 4404059 (1983-09-01), Livshits et al.
patent: 5219713 (1993-06-01), Robinson
patent: 5738797 (1998-04-01), Belke, Jr. et al.
Goenka Lakhi Nandlal
Paruchuri Mohan R.
Dang Thi
Hodges Leslie C.
Visteon Global Technologies Inc.
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