Method for strengthening a solder joint when attaching integrate

Details Method for strengthening a solder joint when attaching integrate Method for strengthening a solder joint when attaching integrate

1996-09-19

1998-11-03

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228231, 148528, B23K 3102

Patent

active

058296670

ABSTRACT:
A method for increasing the strength of a solder joint between a nickel-iron lead frame of an electronic circuit module and a copper pad of a printed circuit board on which the module is mounted includes baking the joint for at least one hour at a temperature in the range 373K to 456K. The baking step is found to significantly increase the strength of the joint.

REFERENCES:
patent: 3411961 (1968-11-01), Harvey
patent: 4611746 (1986-09-01), Levine et al.
patent: 5188982 (1993-02-01), Huang
patent: 5236118 (1993-08-01), Bower et al.
Kwang-Lung Lin et al., Wetting Behavior Between Solder and Electroless Nickel Deposits, Materials Chemistry and Physics, V. 38, 1994, pp. 33-41.
W. Engelmaier, et al., Component Lead and Attachment, Circuits Assembly, Jun. 1995, pp. 72-75.

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