Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1997-03-11
1999-02-16
Bowers, Charles
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438106, 438 15, 438459, 438977, 257686, 257777, 361735, H01L 21283, H01L 2118, H01L 21027, H01L 2131
Patent
active
058720251
ABSTRACT:
Stacked three-dimensional devices can be prepared by stacking wafers as an alternative to stacking individual devices. Chip regions are formed on several wafers with each chip region being surrounded by a separation region, such as an insulator filled trench. The wafers are then stacked with the chip regions in alignment. Aligning the wafers can be facilitated using notched regions in the periphery of the wafers. The wafers are then joined together by lamination. After laminating the stacks of wafers, stacks of chips are separated by etching, dicing or other processes, which separate out stacked chip devices from the stacked wafer at the chip separation regions. The process allows several stacked chip devices to be manufactured simultaneously.
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Cronin John E.
Palagonia Anthony
Pierson Bernadette A.
Schmidt Dennis A.
Blum David S.
Bowers Charles
International Business Machines - Corporation
Shkurko, Esq. Eugene I.
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