Method for stabilization of header plate flange and end tank wal

Details Method for stabilization of header plate flange and end tank wal Method for stabilization of header plate flange and end tank wal

1987-02-06

1988-04-26

Godici, Nicholas P.

Metal fusion bonding

Process

With shaping

228183, 228 151, 291573D, 291573R, 29727, 72379, 72409, 72414, 413 4, 413 21, B23K 120, B23K 3102

Patent

active

047399180

ABSTRACT:
When the free marginal portions 42 are telescoped within the confines of the peripheral flange 36 preparatory to the soldering operation, inward pressure on the end tank 38 usually is maintained during the soldering operation. Of course, the soldering operation involves the application of heat to both the peripheral flange 36 and the peripheral side wall 40. This sometimes will cause the free marginal portion 42 of the peripheral side wall 40 to deform inwardly away from the peripheral flange 36, thus leaving excessive spacing between the free marginal portion 42 and the peripheral flange 36. In order to avoid this condition, raised dimples 44 are formed in the header plate 34 along the peripheral flange 36 and spaced slightly inward from the latter a distance equal to the thickness of the peripheral side wall 40. Thus, the free marginal portion 42 is embraced between the inner surface of the peripheral flange 36 and the dimples 44 and thus stabilized in proper contacting juxtaposition with the peripheral flange 36. This stabilization of the free marginal portion 42 of the peripheral side wall 40 is maintained throughout the heating operation and the subsequent solder melting and flowing operation in order to form a strong and durable solder connection between the free marginal portion 42 of the peripheral side wall 40 and the peripheral flange 36.

REFERENCES:
patent: 2274550 (1942-02-01), Karmazin
patent: 3750248 (1973-08-01), Morris
patent: 4461348 (1984-07-01), Toge et al.
patent: 4512700 (1985-04-01), Santoni
patent: 4614106 (1986-09-01), Forget

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