Method for sputtering with low frequency alternating current

Details Method for sputtering with low frequency alternating current Method for sputtering with low frequency alternating current

1994-09-21

1996-04-30

Weisstuch, Aaron

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming nonelectrolytic coating before depositing...

20419212, 20419215, 20419216, 20429808, C23C 2802, C23C 1434

Patent

active

055121640

ABSTRACT:
Low frequency alternating current sputtering is provided by connecting a low frequency alternating current source to a high voltage transformer having outer taps and a center tap for stepping up the voltage of the alternating current. The center tap of the transformer is connected to a vacuum vessel containing argon or helium gas. Target electrodes, in close proximity to each other, and containing material with which the substrates will be coated, are connected to the outer taps of the transformer. With an applied potential, the gas will ionize and sputtering from the target electrodes onto the substrate will then result. The target electrodes can be copper or boron, and the substrate can be stainless steel, aluminum, or titanium. Copper coatings produced are used in place of nickel and/or copper striking.

REFERENCES:
patent: 4724296 (1988-02-01), Morley
patent: 5013604 (1991-05-01), Allen et al.
patent: 5082546 (1992-01-01), Szczyrbowski et al.
"New Techniques for Sputtering Pure Boron and Boron-Carbon Compositions", Timberlake, et al., Abstract for 33rd Meeting, Division of Plasma Physics Nov. 4, 1991.

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