Method for soldering void-free joints

Details Method for soldering void-free joints Method for soldering void-free joints

1987-11-30

1989-08-29

Rowan, Kurt

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228123, B23K 2000

Patent

active

048609420

ABSTRACT:
A process for soldering without using flux and producing a void-free joint comprises the steps of melting the solder in a reducing gas atmosphere such as hydrogen, evacuating the gas to permit the solder joint to expell any trapped gas, then reintroducing the reducing gas and cooling the solder joint. The reducing gas obviates the use of flux to avoid oxidation from interfering with the wetting of the materials to be joined. The materials may be metalized prior to soldering to permit wetting of certain materials such as ceramic.

REFERENCES:
patent: 2835967 (1958-05-01), Umblia
patent: 3055096 (1962-09-01), Bertossa
patent: 3576066 (1971-04-01), Steward
patent: 3608187 (1971-09-01), Shutt Jr. et al.
patent: 4278195 (1981-07-01), Singh
patent: 4375008 (1983-02-01), Dathe
patent: 4566625 (1986-01-01), Moe
patent: 4576659 (1986-03-01), Lewis et al.

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