Method for soldering two kinds of parts on one-side printed boar

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29840, 228136, H05K 330

Patent

active

050706047

ABSTRACT:
The present invention relates to a method for soldering two kinds of parts, parts with leads and chip parts, on one-side printed board, comprising coating a cream solder on a plurality of points of a wiring pattern surface of one-side printed board and coating an adhesive for adhering parts with leads on a non-wiring pattern, adhering parts with leads to said non-wiring pattern surface by said adhesive, passing leads of the parts with leads through lead insert holes of said one-side printed board to insert the same into one cream solder on the wiring pattern surface from the side of the non-wiring pattern surface, mounting chip parts on the other cream solder on said wiring pattern surface, thereafter heating at once the whole cream solder on the wiring pattern to simultaneously reflow-solder the parts with leads and chip parts whereby the parts with leads and the chip parts can be simultaneously soldered by a single reflow soldering step.

REFERENCES:
patent: 4506443 (1985-03-01), Itoh
patent: 4515304 (1985-05-01), Berger
patent: 4761881 (1988-08-01), Bora et al.
patent: 4982376 (1991-01-01), Megens et al.

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