Method for soldering leads to electrical components

Details Method for soldering leads to electrical components Method for soldering leads to electrical components

1980-09-08

1982-07-13

Goldberg, Elliot A.

Electric heating

Metal heating

For bonding with pressure

29 2542, 228179, 228208, 361273, B23K 102

Patent

active

043396518

ABSTRACT:
A method is disclosed for soldering leads to electrical components such as capacitors on which a thin contacting layer of solder metal is provided. The leads are soldered on by pressing them into the contact layer by means of two electrodes. The leads are heated by a current which flows between the electrodes. In order to save material, the leads are contacted by the electrodes along the entire extent to be sealed in to heat them uniformly and to press them into the contact layer. This method is suitable for contacting capacitors whose dielectrics consist of synthetic films and whose coatings consist of regenerable thin metalizations.

REFERENCES:
patent: 3381081 (1968-04-01), Schalliol
patent: 3444347 (1969-05-01), Mulcahy
patent: 3693244 (1972-09-01), Behn et al.
patent: 3857074 (1974-12-01), Heywawo

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