Method for soldering electronic component and soldering...

Details Method for soldering electronic component and soldering... Method for soldering electronic component and soldering...

2006-11-10

2009-12-15

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000, C438S612000, C257S780000, C257S778000, C257S779000, C257S738000, C257SE23021, C257SE23023

Reexamination Certificate

active

07632710

ABSTRACT:
In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder8is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder8has a flake or dendrite shape including a core segment8aof the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment8bof the metal with good-wettability for the molten solder and to be solid-solved in the core segment8amolten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles18.Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

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International Search Report Dated Mar. 21, 2007.

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