Method for soldering components onto printed circuit boards

Details Method for soldering components onto printed circuit boards Method for soldering components onto printed circuit boards

1990-09-25

1992-01-14

Evans, Geoffrey S.

Electric heating

Metal heating

For bonding with pressure

B23K 100, B23K 3047

Patent

active

050813366

ABSTRACT:
A method wherein the component to be soldered is placed onto the printed circuit board, whereupon the stirrup electrodes of the soldering mechanism are lowered and the terminal legs of the component are pressed against the printed circuit board with a force. After heating the stirrup electrodes for melting the solder, a further advance of the stirrup electrodes ensues for impressing the terminal legs into the molten solder. The formation of a solder layer between terminal legs and printed circuit board subsequently ensues by reducing the force exerted onto the stirrup electrodes and/or by defined retraction of the stirrup electrodes.

REFERENCES:
patent: 4135630 (1979-01-01), Snyder et al.
patent: 4255644 (1981-03-01), Delorme
patent: 4552300 (1985-11-01), Zovko et al.
patent: 4605833 (1986-08-01), Lindberg
patent: 4805830 (1989-02-01), Kawaguchi
patent: 4910383 (1990-03-01), Zimmer
patent: 4942282 (1990-07-01), Jensen
patent: 4982890 (1991-01-01), Schuster et al.
"Soldering Machines take on Quad Flat Packs", p. 14 of Electroniz Packaging and Production; Feb. 1988.

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