Method for soldering and apparatus therefor

Details Method for soldering and apparatus therefor Method for soldering and apparatus therefor

1991-09-30

1992-12-08

Seidel, Richard K.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

2281802, B23K 120

Patent

active

051690578

ABSTRACT:
A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.

REFERENCES:
patent: 3818415 (1974-06-01), Evans et al.
patent: 4451541 (1984-05-01), Beal
patent: 5052155 (1991-10-01), Blacks et al.

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