Metal fusion bonding – Process – Plural joints
Patent
1999-04-30
2000-09-19
Ryan, Patrick
Metal fusion bonding
Process
Plural joints
29840, 361768, B23K 3100, H05K 334
Patent
active
061199257
ABSTRACT:
A method for soldering an electrical element to a mother board includes the following steps. Firstly, the electrical element is prepared for soldering and deposited on an appropriate machine. Secondly, solder balls are deposited at openings of terminal receiving passageways of the electrical element by means of appropriate tools. Thirdly, the solder balls are heated to a semi-meltdown status and top surfaces of the solder balls are leveled by means of leveling tools. Lastly, the solder balls are mounted onto corresponding electrical contact pads of the mother board and reheated to melting temperature thereby completing the soldering process.
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Lin Nick
Liu Jeng-Shiun
Chung Wei Te
Edmondson L.
Hon Hai - Precision Ind. Co., Ltd.
Ryan Patrick
LandOfFree
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