Method for soldering a semiconductor device to a circuitized sub

Details Method for soldering a semiconductor device to a circuitized sub Method for soldering a semiconductor device to a circuitized sub

1991-09-23

1993-05-04

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228242, B23K 3100, H05K 300

Patent

active

052073726

ABSTRACT:
A method for bonding a semiconductor device onto a substrate (e.g., a printed circuit board) such that solder elements on the device are connected, respectively, to circuit elements on the substrate. The solder elements are heated by passing hot gas onto an opposing surface of the device such that, by heat transference, the solder elements become partially molten to form the desired connections. Pressure is also applied onto the device during this formation to assure planarity at the connection sites. Following formation, cooling of the connections is accomplished. By directing heated gas onto only the semiconductor device and not onto the solder element-circuit member locations (and thus onto the substrate), direct semiconductor device bonding to lower melting point temperature substrates (e.g., those circuit boards containing fiberglass reinforced epoxy resin as a dielectric) may be achieved.

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patent: 4887760 (1989-12-01), Yoshino et al.
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patent: 5115964 (1992-05-01), Ameen et al.
Spigarelli, D. J. "How to Use Intergral Vision And Reflow for Placement of Fine Pitch SMC's", Surface Mount Tech., Feb. 1987, pp. 31-32.

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