Method for soldering

Details Method for soldering Method for soldering

1996-07-26

1999-03-16

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228203, 228211, B23K 3102

Patent

active

058819479

ABSTRACT:
A method for soldering components to opposite sides of a receptive element includes the steps of applying a solder formulation to both sides of the receptive element (201) and placing components on a first side of the receptive element (204). The solder formulation is hardened on the first side of the receptive element (205). Components are placed on a second side of the receptive element and the solder formulation on the second side of the receptive element is hardened. The components are fixed to the receptive element by performing a single reflow operation (208).

REFERENCES:
patent: 4515304 (1985-05-01), Berger
patent: 4789096 (1988-12-01), Dunn et al.
patent: 5152451 (1992-10-01), Darveaux et al.
patent: 5373984 (1994-12-01), Wentworth

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