Method for solder crack deflection

Details Method for solder crack deflection Method for solder crack deflection

2007-05-29

2007-05-29

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21511

Reexamination Certificate

active

10306946

ABSTRACT:
An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.

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