Metal fusion bonding – Process – Plural joints
Patent
1996-04-19
1997-09-16
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228193, 228106, 228265, H05K 332
Patent
active
056671326
ABSTRACT:
Solder bonding of first and second contact pad arrays is accomplished by forming contact structures, such as posts with vertical or tapered sides, on the contact pads of the first array and solder bumps on the second array. The respective contact structures should have an average cross-sectional area that is less than the average cross-sectional area of the corresponding solder bumps. The contact structures and solder bumps are then bonded by a bonding process at a temperature and pressure where the solder bumps deform and envelop at least a portion of the respective contact structures. It is possible to employ the contact structures as a compression stop during the bonding process. The temperature should be below the melting points of the contact structures. In this manner, solder bump spreading can be reduced during bonding which correspondingly reduces electrical shorting of adjacent formed interconnect bonds.
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patent: 3591839 (1971-07-01), Evans
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patent: 4739917 (1988-04-01), Baker
K.W. Grossen et al., "GaAs MQW Modulators Integrated with Silicon CMOS", IEEE Photonics Technology Letters, vol. 7, No. 4, pp. 360-362 (1995).
Chirovsky Leo Maria Freishyn
D'Asaro Lucian Arthur
Dahringer Donald William
Hui Sanghee Park
Tseng Betty Jyue
Heinrich Samuel M.
Lucent Technologies - Inc.
Rudnick Robert E.
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